4. Expansion Slots

4.1. High Speed Extension Slot

The board-to-board slot labeled as “CN3” is a combination connector reserved for connecting to a customized expansion card. The connector pinout supports PCIe, LAN, USB 2.0, Audio, SDIO and SIM.

Figure 1: High Speed Extension tension Slot

High Speed Extension Slot pinout:

Pin	Signal	Pin	Signal
1	+5VSUS	2	+5VSUS
3	+5VSUS	4	+5VSUS
5	+5VSUS	6	+5VSUS
7	+12V	8	+12V
9	GND	10	GND
11	GND	12	GND
13	GND	14	GND
15	TVCLKRIN	16	MICIN2_R
17	SPDIF_TX1	18	MICIN2_L
19	MCVREF02	20	LINE2_R
21	SENSE_B	22	LINE2_L
23	GND	24	GND
25	FANCTL2	26	SPEAK_BZ
27	FANIN2	28	GPIO37
29	-PCIRST	30	-RING
31	RST_SW	32	SD_CLK/MMC_CLK
33	PW_BN1-	34	CR_CMD
35	-SUSC	36	CR_D7
37	-SUSB	38	CR_D6
39	-CR_CD	40	CR_D5
41	-CR_WPD	42	CR_D4
43	VCCCR	44	CR_D3
45	CR_PWSELS	46	CR_D2
47	CR_PWSEL	48	CR_D1
49	CR_PWOFF	50	CR_D0
51	GND	52	GND
53	-HD_LED	54	VREFOUT_E
55	-PWR_LED	56	DVPCLKN
57	LVDSPWM1	58	DVPCLKP
59	DVPSPCLK	60	DVP1DE
61	DVPSPD	62	DVP1HS
63	SMBDT	64	DVP1VS
65	SMBCK	66	DVP1D11
67	-PEREQ1	68	DVP1D10
69	-PEXWAKE	70	DVP1D9
71	-PEX4RST	72	DVP1D8
73	-PEX2RST	74	DVP1D7
75	-PEX1RST	76	DVP1D6
77	GND	78	DVP1D5
79	USBHP3-	80	DVP1D4
81	USBHP3+	82	DVP1D3
83	GND	84	DVP1D2
85	PEXRX2+	86	DVP1D1
87	PEXRX2-	88	DVP1D0
89	GND	90	GND
91	PETN2	92	USBHP4-
93	PETP2	94	USBHP4+
95	GND	96	GND
97	PE6CLK-	98	USBHP2-
99	PE6CLK+	100	USBHP2+
101	GND	102	GND
103	PEXRX0-	104	PEXRX4-
105	PEXRX0+	106	PEXRX4+
107	GND	108	GND
109	PETN0	110	PETN4
111	PETP0	112	PETP4
113	GND	114	GND
115	PE1CLK-	116	PE3CLK-
117	PE1CLK+	118	PE3CLK+
119	GND	120	GND

4.2. DDR3 SODIMM Memory Slot

The mainboard provides one 204-pin DDR3 SODIMM slot that supports non- ECC DDR3 1600/1333/1066 SODIMM memory modules. The memory slot can accommodate up to 8 GB of DDR3 1600/1333/1066 memory. The memory slot is labeled as “SODIMM1”. The location of the DDR3 memory slot is shown below.

Figure 2: DDR3 SODIMM memory slot

4.2.1. Installing a Memory Module

Step 1

Align the notch on the SODIMM memory module with the protruding wedge on the SODIMM memory slot. Insert the SODIMM memory module at a 30 degree angle relative to the SODIMM memory slot.

Figure 3: Inserting the memory module

Step 2

Insert the SODIMM memory module between the two rows of pins. Then push down until the locking clips lock the SODIMM memory module into place. There will be a slight tension as the SODIMM memory module is being locked.

Figure 4: Locking the memory module

Step 3

Install the memory thermal pad on the top of the DRAM memory module.

Figure 5: Installing memory thermal pad

The memory thermal pad is used for transferring the heat dissipation of memory to the thermal plate or bottom plate to attain memory cooling, and to ensure the operating temperature of the memory module should not exceed to 85°C. This helps to prevent damage of the memory module. The memory thermal pad to be used is requires a certain thickness in order to make contact with the memory thermal plate or bottom plate to excellently disperse the heat.

Warning

1. The customer/user should consider using the memory thermal pad and adding memory thermal plate or bottom plate on their chassis design.
2. The memory thermal plate/bottom plate material to be used should have an excellent thermal conductivity. Avoid using plastic or rubber materials.
3. The thickness of memory thermal pad should be based on customer’s design. However, the minimum value of thermal conductivity K (W/m.k) is 1.5 and the maximum of hardness is 5 (Shore A).

4.2.2. Removing a Memory Module

Step 1

To disengage the locking clips, push the locking clips horizontally outward away from the SODIMM memory module.

Figure 6: Disengaging the SODIMM locking clips

Step 2

When the locking clips have cleared, the SODIMM memory module will automatically pop up to the 30 degree angle. Remove the memory module.

Figure 7: Removing the memory module