.. _expansion: Expansion Slots =============== High Speed Extension Slot ------------------------- The board-to-board slot labeled as "CN3" is a combination connector reserved for connecting to a customized expansion card. The connector pinout supports PCIe, LAN, USB 2.0, Audio, SDIO and SIM. .. _figure-high-speed-extension: .. figure:: images/high_speed_extension.* :align: center :alt: High Speed Extension tension Slot High Speed Extension tension Slot High Speed Extension Slot pinout: ==== ============== ==== =============== Pin Signal Pin Signal ==== ============== ==== =============== 1 +5VSUS 2 +5VSUS 3 +5VSUS 4 +5VSUS 5 +5VSUS 6 +5VSUS 7 +12V 8 +12V 9 GND 10 GND 11 GND 12 GND 13 GND 14 GND 15 TVCLKRIN 16 MICIN2_R 17 SPDIF_TX1 18 MICIN2_L 19 MCVREF02 20 LINE2_R 21 SENSE_B 22 LINE2_L 23 GND 24 GND 25 FANCTL2 26 SPEAK_BZ 27 FANIN2 28 GPIO37 29 -PCIRST 30 -RING 31 RST_SW 32 SD_CLK/MMC_CLK 33 PW_BN1- 34 CR_CMD 35 -SUSC 36 CR_D7 37 -SUSB 38 CR_D6 39 -CR_CD 40 CR_D5 41 -CR_WPD 42 CR_D4 43 VCCCR 44 CR_D3 45 CR_PWSELS 46 CR_D2 47 CR_PWSEL 48 CR_D1 49 CR_PWOFF 50 CR_D0 51 GND 52 GND 53 -HD_LED 54 VREFOUT_E 55 -PWR_LED 56 DVPCLKN 57 LVDSPWM1 58 DVPCLKP 59 DVPSPCLK 60 DVP1DE 61 DVPSPD 62 DVP1HS 63 SMBDT 64 DVP1VS 65 SMBCK 66 DVP1D11 67 -PEREQ1 68 DVP1D10 69 -PEXWAKE 70 DVP1D9 71 -PEX4RST 72 DVP1D8 73 -PEX2RST 74 DVP1D7 75 -PEX1RST 76 DVP1D6 77 GND 78 DVP1D5 79 USBHP3- 80 DVP1D4 81 USBHP3+ 82 DVP1D3 83 GND 84 DVP1D2 85 PEXRX2+ 86 DVP1D1 87 PEXRX2- 88 DVP1D0 89 GND 90 GND 91 PETN2 92 USBHP4- 93 PETP2 94 USBHP4+ 95 GND 96 GND 97 PE6CLK- 98 USBHP2- 99 PE6CLK+ 100 USBHP2+ 101 GND 102 GND 103 PEXRX0- 104 PEXRX4- 105 PEXRX0+ 106 PEXRX4+ 107 GND 108 GND 109 PETN0 110 PETN4 111 PETP0 112 PETP4 113 GND 114 GND 115 PE1CLK- 116 PE3CLK- 117 PE1CLK+ 118 PE3CLK+ 119 GND 120 GND ==== ============== ==== =============== DDR3 SODIMM Memory Slot ----------------------- The mainboard provides one 204-pin DDR3 SODIMM slot that supports non- ECC DDR3 1600/1333/1066 SODIMM memory modules. The memory slot can accommodate up to 8 GB of DDR3 1600/1333/1066 memory. The memory slot is labeled as "SODIMM1". The location of the DDR3 memory slot is shown below. .. _figure-ddr: .. figure:: images/ddr.* :align: center :alt: DDR3 SODIMM memory slot DDR3 SODIMM memory slot Installing a Memory Module ^^^^^^^^^^^^^^^^^^^^^^^^^^ **Step 1** Align the notch on the SODIMM memory module with the protruding wedge on the SODIMM memory slot. Insert the SODIMM memory module at a 30 degree angle relative to the SODIMM memory slot. .. _figure-ddr-install1: .. figure:: images/ddr_install1.* :align: center :alt: Inserting the memory module Inserting the memory module **Step 2** Insert the SODIMM memory module between the two rows of pins. Then push down until the locking clips lock the SODIMM memory module into place. There will be a slight tension as the SODIMM memory module is being locked. .. _figure-ddr-install2: .. figure:: images/ddr_install2.* :align: center :alt: Locking the memory module Locking the memory module **Step 3** Install the memory thermal pad on the top of the DRAM memory module. .. _figure-ddr-install3: .. figure:: images/ddr_install3.* :align: center :alt: Installing memory thermal pad Installing memory thermal pad The memory thermal pad is used for transferring the heat dissipation of memory to the thermal plate or bottom plate to attain memory cooling, and to ensure the operating temperature of the memory module should not exceed to 85°C. This helps to prevent damage of the memory module. The memory thermal pad to be used is requires a certain thickness in order to make contact with the memory thermal plate or bottom plate to excellently disperse the heat. .. warning:: 1. The customer/user should consider using the memory thermal pad and adding memory thermal plate or bottom plate on their chassis design. 2. The memory thermal plate/bottom plate material to be used should have an excellent thermal conductivity. Avoid using plastic or rubber materials. 3. The thickness of memory thermal pad should be based on customer’s design. However, the minimum value of thermal conductivity K (W/m.k) is 1.5 and the maximum of hardness is 5 (Shore A). Removing a Memory Module ^^^^^^^^^^^^^^^^^^^^^^^^ **Step 1** To disengage the locking clips, push the locking clips horizontally outward away from the SODIMM memory module. .. _figure-ddr-install4: .. figure:: images/ddr_install4.* :align: center :alt: Disengaging the SODIMM locking clips Disengaging the SODIMM locking clips **Step 2** When the locking clips have cleared, the SODIMM memory module will automatically pop up to the 30 degree angle. Remove the memory module. .. _figure-ddr-install5: .. figure:: images/ddr_install5.* :align: center :alt: Removing the memory module Removing the memory module